Micro Silicon Electronics Co., Ltd. provides semiconductor backend services in Taiwan, rest of Asia, the United States, and Europe. The company offers semiconductor testing services, such as CP and FT testing; wafer thinning services, including back grinding and backside metallization, and frontside metallization; and semiconductor packaging services comprising COB and COG dicing, and WLCSP-DPS. It also engages in the design, processing, testing, manufacture, and sale of integrated circuits. In addition, the company offers probe card maintenance services. The company was founded in 1987 and is headquartered in Zhunan, Taiwan.