Ventec International Group Co.,Ltd. engages in research and development, production, and sale of copper foil substrates (CCL), heat dissipation aluminum substrates (IMS) and prepreg. The company offers standard FR4, lead free assembly, halogen free products, tec-thermal/thermal management and insulated metal substrate, polyimide, tec-speed/signal integrity and high frequency products, tec-packs/ IC packaging, pro-bond and thermal bonds, and flex/flex rigid products, as well as products for special applications. It also distributes flexible laminates and coverlays, Taiyo solder mask products, thermal interface materials, consumables and lamination accessories, cardel press plates, PCB process equipment, PCB drills and routers, plastic interleaver and release film consumables, drill entry and exit material, copper foils and ACF, and masslam and drill products to the Middle East, Europe, and the United States. The company's products are used for the fabrication of various printed circuit board and associated applications. In addition, it engages in the general investment business. Ventec International Group Co.,Ltd. was founded in 2000 and is headquartered in Grand Cayman, the Cayman Islands.