Greatek Electronics Inc., together with its subsidiary, provides semiconductor assembly and testing services in Taiwan, rest of Asia, the United States, Europe, and Africa. The company offers wafer and final testing services, including testing program development, platform conversion, devices correlation, engineering, test peripheral equipment, and spare parts development service for logic, mix mode, and analog devices; IC semiconductor package assembly services; final test services; and package design services for electrical and thermal characterization. It also provides leadframe based package services, including wafer bumping; wafer level CSP; ball-grid arrays/LGA; flip chip chip scale packages; quad flat no-leads (QFN)/DFN; flip chip QFN/DFN/SOP/TSOT; P-DIP; transistor outline and small outline transistor; small-outline package/shrink small-outline package/thin shrink small-outline package; small outline j-leaded and plastic leaded chip carrier; and quad flat package (QFP)/low profile QFP/thin QFP. In addition, the company offers metal plating on semiconductor lead frames. The company was formerly known as He Teh Integrated Circuit Co. Ltd. in October 1995. Greatek Electronics Inc. was founded in 1972 and is based in Miaoli, Taiwan.