Egide S.A., together with its subsidiaries, develops, manufactures, and sells hermetic package solutions for micro-electronic and optical product applications in France, Europe, the United States, Canada, and internationally. The company offers designs and manufactures packages for the thermal imaging market; window assemblies, high-precision window holders, high-precision co-fired ceramic (HTCC) feedthroughs, hermetic housing, ceramic boards, getter welding, and cold fingers for cooled IR systems; and power packages. It also provides protection and interconnection of the opto-electronics chips; various RF packages for various markets; RF and DC glass beads, and SMPM connector; and HTCC packages, including surface mount and lead-frame, as well as leadless packages comprising ball grid array, land grid array, quad flat no-lead and leadless chip carrier, and pin grid array, HTTC connectors, and HTCC ceramic substrates. The company serves aerospace, defense, medical, opto-electronics, infra-red, sensors, RF, communications, and other market. Egide S.A. was incorporated in 1986 and is headquartered in Bollène, France.